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Table 5

Heating and cooling processes implemented in KOSMA-.

ID Notes
1 h/c Collisional de-excitation of vibrationally excited H2
2 h Photo-dissociation heating of H2
3 h H2-formation heating using 1/3 of the binding energy of 4.48 eV
4 c [O I] 3P13P2 (63 µm) line cooling
5 c [O I] 3P03P2 (44 µm) line cooling (negligible)
6 c [O I] 3P03P1 (146 µm) line cooling
7 h Cosmic ray heating (Glassgold et al. 2012)
8 h/c Grain photoelectric (PE) heating (minus recombination)
9 c 12CO line cooling (J = 0–49)
10 c [C II] 2P3/22P1/2(158 µm) line cooling (13C+ implemented but not used)
11 c [C I] 3P13P0 line cooling
12 c [C I] 3P23P0 line cooling(negligible)
13 c [C I] 3P23P1 line cooling
14 c [Si II] 2P3/22P1/2 (35 µm) line cooling
15 c 13CO line cooling (J = 0–49)
16 c H I Lyman-→ cooling (Spitzer 1978)
17 c H2O line cooling (Neufeld & Melnick 1987)
18 h/c Gas-grain collisions
19 c OH line cooling (including lowest 16 energy levels)
20 c O I 6300 Å cooling (Bakes & Tielens 1994)
21 c H2 photo-dissociation kinetic cooling (Lepp & Shull 1983)
22 h Carbon photo-ionization heating (Tielens & Hollenbach 1985)

Notes. h and c denote heating and cooling processes respectively. Some process may either cool or heat. The ID corresponds to the internal storage order in the code and to the subscripts of the heating and cooling rates ΓID, Λid.

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