ALMA Band 5 IF hybrid assembly. The IF hybrid assembly is integrated into a box with five separate silicon substrates with niobium superconducting circuitry: two bias-T chips for DC / IF separation, the IF 90-degree hybrid chip, and two output transmission lines (Rashid et al. 2014). The inserts show magnified DC/IF bias-T chip (upper left inset) and the scanning electron microscope image (lower left inset) of the air-bridges with the height of about 5 μm, which connect the fingers of the Lange coupler. All internal parts of the IF hybrid assembly were fabricated by GARD using the Nanofabrication Laboratory Clean room facility at Chalmers University.