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R EQUIREMENT | D ESIGN S OLUTION | |||||||
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R | Diameter | R | P at FPU | |||
I TEM............... | N | [mA] | [mA] | ![]() |
Material | [AWG, mm] | ![]() |
[mW] |
HEMT GND............... | 11 | 40 | 200 | <1 | Copper | 38 (0.1) | 0.6 | 6.32 |
HEMT Drain............... | 44 | 10 | 50 | <5 | Nickel | 38 (0.1) | 2.2 | 11.37 |
HEMT Gate............... | 88 | 100 | 100 | <200 | Manganin | 40 (0.08) | 193.4 | 1.86 |
Phase Switch GND........................... | 11 | 4 | 4 | <10 | Titanium | 32 (0.2) | 5.2 | 1.55 |
Phase Switch............... | 88 | 1 | 1 | <50 | Titanium | 38 (0.1) | 21.0 | 5.88 |
Shield........................... | ![]() |
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Al + Kapton | 100 nm | ![]() |
2.28 |
Temperature Sensors.. | 48 | 40 | 40 | <200 | Manganin | 40 (0.08) | 139.3 | 0.93 |
TOTAL.................... | 290 | 30.20 |
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