Open Access
Table 1.
Main characteristics of the arrays.
| Wavelength | 3 mm | 2 mm | 1.25 mm | 850 μm | 550 μm |
|---|---|---|---|---|---|
| frequency | 100 GHz | 150 GHz | 240 GHz | 360 GHz | 550 GHz |
| Film material | Ti-Al | Al | Al | Al | Al |
| Film thickness [nm] | 10–25 | 18 | 15 | 15 | 15 |
| Critical temperature [K] | 900 | ≈1.3 | 1.45 | 1.45 | 1.45 |
| Substrate material | Al2O3 | Al2O3 | Si | Si | Si |
| Substrate thickness [μm] | 430 | 330 | 280 | 265 | 170 |
| AR layer thickness [μm] | 0 | 0 | 110 | 110 | 80 |
| Backshort thickness [μm] | 750 | 670 | 530 | 350 | 400 |
| LEKID meander type | CL | H | H | CL | CL |
| Pixel size [mm] | 2.3 | 2.3 | 1 | 1 | 1 |
| Design pixels/array [#] | 132 | 132 | 132 | 128 | 128 |
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